Press Release 2023-09-29 12:39 (PR) Intel’s new fab begins high-volume production of Intel 4 chips in Ireland
Press Release 2023-09-18 13:20 (PR) Intel introduces glass substrates for next-generation advanced chip packaging
Press Release 2023-06-28 07:48 (PR) Samsung will begin mass production of 2nm process in 2025, expanding to HPC in 2026
Press Release 2023-06-05 13:27 (PR) Intel PowerVia technology shows 6% performance gain on Meteor Lake E-core test chip
Press Release 2023-04-12 13:57 (PR) Intel and ARM reach SoC manufacturing deal, low-power mobile processors to use Intel 18A process
Press Release 2023-03-21 15:34 (PR) NVIDIA cuLitho to deliver up to 40x performance leap in litography
Press Release 2022-12-29 08:19 (PR) TSMC holds 3nm “Volume Production and Capacity Expansion Ceremony” at Fab 18 construction site
Press Release 2022-10-04 06:11 (PR) Samsung targets mass production of 1.4nm process technology by 2027
Press Release 2022-06-30 05:56 (PR) Samsung begins initial production of 3nm chips using Gate-All-Around architecture
Press Release 2022-06-16 20:34 (PR) TSMC announces FINFLEX technology for its N3 node, nanosheet-based N2 in 2025
News 2022-06-11 13:14 Intel 14th Gen Core “Meteor Lake-P” die shot with 6 Performance and 8 Efficient cores has been revealed
Press Release 2022-04-11 17:20 (PR) Intel announces $3B DIX-Mod3 Oregon factory expansion and new manufacturing roadmap
Press Release 2022-03-15 13:17 (PR) Intel announces new semiconductor fab in Magdeburg (Germany) and its 80B EUR European Union investment plans
Press Release 2022-01-19 08:09 (PR) Intel first to purchase ASML Twinscan EXE:5200 EUV.55 High-NA systems
Press Release 2021-12-16 10:05 (PR) TSMC announces N4X process technology for HPCs, risk production starts in 1H 2023
Press Release 2021-12-11 22:30 (PR) Intel targets 30% to 50% logic scaling improvements beyond 2025 with 3D stacked transistors, Foveros Direct
Press Release 2021-10-26 15:43 (PR) TSMC announces N4P Process technology with 22% higher efficiency over N5
Press Release 2021-05-06 12:58 (PR) Samsung announces “I-Cube4” 2.5D integration solution for high-performance applications
Press Release 2020-07-06 09:05 (PR) Samsung researchers discover new semiconducting material called Amorphous Boron Nitride (a-BN)
Press Release 2020-07-02 06:41 (PR) Globalfoundaries announces 12LP+ FinFET solution ready for production
Press Release 2020-05-15 06:26 (PR) TSMC to build and operate 5nm Semiconductor Fab in the United States
