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SK hynix Develops World’s Best Performing HBM3E, Provides Samples to Customer for Performance Evaluation
- Product to drive AI tech innovation with industry’s top performance to be produced in volume from 1H24
- Launch of HBM3E to solidify SK hynix’s unrivaled leadership in AI memory market following success of HBM3
- Expansion of HBM3E supply following industry’s largest scale of mass production of HBM to help accelerate business turnaround
SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it successfully developed HBM3E, the next-generation of the highest-specification DRAM for AI applications currently available, and said a customer’s evaluation of samples is underway.
According to the company, the latest product not only meets the industry’shighest standards of speed, the key specification for AI memory products, but all categories including capacity, heat dissipation and user-friendliness.
In terms of speed, the HBM3E can process data up to 1.15 terabytes(TB) a second, which is equivalent to processing more than 230 Full-HD movies of 5GB-size each in a second.
In addition, the product comes with a 10% improvement in heat dissipation by adopting the cutting-edge technology of the Advanced Mass Reflow Molded Underfill, or MR-MUF, onto the latest product. It also provides backward compatibility that enables the adoption of the latest product even onto the systems that have been prepared for the HBM3 without a design or structure modification.
“We have a long history of working with SK hynix on High Bandwidth Memory for leading edge accelerated computing solutions,” said Ian Buck, Vice President of Hyperscale and HPC Computing at NVIDIA. “We look forward to continuing our collaboration with HBM3E to deliver the next generation of AI computing.”
Sungsoo Ryu, Head of DRAM Product Planning at SK hynix, said that the company, through the development of HBM3E, has strengthened its market leadership by further enhancing the completeness of HBM product lineup, which is in the spotlight amid the development of AI technology. “By increasing the supply share of the high-value HBM products, SK hynix will also seek a fast business turnaround.”
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