Samsung introduces HBM3E ‘Shinebolt’ memory for next-generation AI applications

Published: Oct 20th 2023, 19:33 GMT   Comments

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Samsung Electronics Holds Memory Tech Day 2023 Unveiling New Innovations To Lead the Hyperscale AI Era

New technologies and products include HBM3E Shinebolt, LPDDR5X CAMM2 and Detachable AutoSSD to accelerate innovation for future computing requirements

Introducing HBM3E ‘Shinebolt’

Today’s cloud systems are evolving to optimize compute resources, which require high-performance memory to handle high capacity, bandwidth and virtual storage capabilities. Building on Samsung’s expertise in commercializing the industry’s first HBM2 and opening the HBM market for high-performance computing (HPC) in 2016, the company today revealed its next-generation HBM3E DRAM, named Shinebolt.

Samsung’s Shinebolt will power next-generation AI applications, improving total cost of ownership (TCO) and speeding up AI-model training and inference in the data center. The HBM3E boasts an impressive speed of 9.8 gigabits-per-second (Gbps) per pin speed, meaning it can achieve transfer rates exceeding up to more than 1.2 terabytes-per-second (TBps).

In order to enable higher layer stacks and improve thermal characteristics, Samsung has optimized its non-conductive film (NCF) technology to eliminate gaps between chip layers and maximize thermal conductivity.

Samsung’s 8H and 12H HBM3 products are currently in mass production and samples for Shinebolt are shipping to customers. Leaning into its strength as a total semiconductor solutions provider, the company also plans to offer a custom turnkey service that combines next-generation HBM, advanced packaging technologies and foundry offerings together.

Other products highlighted at the event include the 32Gb DDR5 DRAM with the industry’s highest capacity, the industry’s first 32Gbps GDDR7 and the petabyte-scale PBSSD, which offers a significant boost to storage capabilities for server applications.

Redefining Edge Devices Through Powerful Form Factors
In order to process data-intensive tasks, today’s AI technologies are moving toward a hybrid model that allocates and distributes workload among cloud and edge devices. Accordingly, Samsung introduced a range of memory solutions that support high-performance, high-capacity, low-power and small form factors at the edge.

In addition to the industry’s first 7.5Gbps LPDDR5X CAMM21 — which is expected to be a true game changer in the next-generation PC and laptop DRAM market — the company also showcased its 9.6Gbps LPDDR5X DRAM, LLW2 DRAM specialized for on-device AI, next-generation Universal Flash Storage (UFS), and the high-capacity Quad-Level Cell (QLC) SSD BM9C1 for PCs.

Paving the Road for Automotive Memory Solutions Leadership
With advancements in autonomous driving solutions, market demand is also rising for high-bandwidth, high-capacity DRAM and Shared SSDs, which share data with multiple System on Chips (SoCs). Samsung presented its Detachable AutoSSD that allows data access from a single SSD to multiple SoCs through virtual storage.

The Detachable AutoSSD supports sequential read speed of up to 6,500 megabytes-per-second (MBps) with 4TB of capacity. As it comes in a detachable form factor, the SSD makes upgrades and adjustments easier for vehicle users and manufacturers. Samsung also displayed automotive memory solutions such as high-bandwidth GDDR7 and LPDDR5X with a more compact package size.

Technology That Makes Technology Sustainable
As part of its commitment to minimizing environmental impact, Samsung underscored a variety of innovations within its semiconductor operations that will contribute to increased energy efficiency for customers and consumers.

The company plans to secure ultra-low-power memory technologies that can decrease power consumption in data centers, PCs and mobile devices, while using recycled materials in portable SSD products to reduce its carbon footprint. Samsung’s next-generation solutions, such as the PBSSD, will also help reduce energy usage for server systems as they maximize space efficiency and rack capacity.

While collaborating with stakeholders across the semiconductor value chain, including customers and partners, Samsung’s semiconductor business will continue to play an active role in tackling global climate issues through its sustainability initiative, “technology that makes technology sustainable.”

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