GIGABYTE announces X570 AORUS XTREME motherboard with 16-phase VRM

Published: 27th May 2019, 04:42 GMT   Comments

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GIGABYTE Advances To PCIe 4.0 With X570 AORUS Motherboards

Flagship 16-Phase Digital Power Design For Full Support Of 3rd Generation AMD Ryzen™ Desktop Processors

Taipei, Taiwan, May 27th, 2019 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced the launch of the newest X570 AORUS series motherboards primed to unleash the potential of the highly anticipated 3rd Gen AMD Ryzen™ desktop™ processors. Fully compatible with these new processors, X570 AORUS series motherboards kick off the PCIe® 4.0 era with extensive feature sets. The flagship X570 AORUS XTREME motherboard is fitted with a 16-phase digital power design for unmatched power management and a Fins-Array Stacked Fin Heatsink with Direct Touch Heatpipes for the strongest VRM cooling. Both features are aimed towards optimizing performance on the 3rd Gen AMD Ryzen desktop processors. Select X570 AORUS motherboards also deliver ultra fast connectivity at 2.4Gbps with the WiFi 6 802.11ax wireless standard and further improve the user experience with the newest iteration of Q-Flash Plus Technology for users to update the BIOS with ease and convenience. X570 AORUS series motherboards lead the new era of gaming performance.

“In anticipation of the release of the AMD X570 chipset and 3rd Gen AMD Ryzen™ desktop processors, GIGABYTE is ready to launch a product series that sets the standard for compatibility and product quality from an AMD platform based motherboard while checking all the boxes for a gaming motherboard,” said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. “Gamers and performance focused users will be impressed with the features that GIGABYTE has implemented on the X570 AORUS motherboards. Some of these highlight features include a 16-phase digital power design, PCIe 4.0, high speed network connectivity, RGB Fusion lighting, and a new BIOS UI. Through our professional research and development, we have engineered a product that offers both the performance and stability gamers are looking for when building an AMD platform desktop.”

The highly anticipated 3rd Gen AMD Ryzen™ desktop processors deliver on the hype, outclassing previous generation processors with impressive performance jumps that users covet when they upgrade from one generation of processors to the next. Capitalizing on this performance potential, GIGABYTE packs at least 14-power phases in the digital power designs of each ATX board in the X570 AORUS Series. Different tasks require different levels of power consumption so to account for this varying power consumption, GIGABYTE uses a PowIRstage or DrMOS and different MOSFETs to ensure a more stable current flow and better power and thermal management while the CPU is running at its full potential. The flagship X570 AORUS XTREME motherboard boasts a 16-phase, all Infineon digital power design with each phase capable of managing up to 70A for lower impedance and improved balance. With 16-phases to work with, the motherboard reduces the loading per phase so that less heat is generated, improving the overall power efficiency, durability and service life of the motherboard. This allows for better performance and better overclocking and enables users to maximize the overclocking potential on the new 3rd Gen AMD Ryzen desktop processors without the concerns of an unstable power supply or high temperatures causing overclocking failures or diminished performance. The Fins-Array Stacked Fin Heatsink, Direct Touch Heatpipes, and the Nanocarbon Baseplate provide an incredible amount of cooling to the VRM and chipset making this the most comprehensive cooling solution for the 3rd Gen AMD Ryzen™ desktop processors, perfect for an AMD platform build.

PCIe 4.0 is here and with it comes higher bandwidth. With 32GB/s bandwidth and increased bandwidth for graphics cards, PCIe NVMe AIC SSDs, and M.2 NVMe SSDs, the new interface far surpasses the bandwidth limitations of previous generations. GIGABYTE has keyed in on the performance potential of PCIe 4.0 and has refined the design of its motherboards to elevate the performance of peripheral components. Design features such as server-grade PCBs with low inductance and a PCIe 4.0 B-CLK IC maximize the PCIe bandwidth to increase the data transmission capacity on PCIe storage devices and boost overclocking performance from CPUs and memory. The motherboard unlocks hidden performance potential on peripheral components, allowing for blazing fast transmission speeds on these devices. As the PCIe 4.0 era arrives, GIGABYTE has also introduced its newest PCIe 4.0 interface based PCIe NVMe M.2 SSD and AORUS M.2 PCIe 4.0 riser cards which allow for 4800 MB/s transmission speeds on the PCIe NVMe M.2 SSDs. Users can install four NVMe M.2 SSDs at once with the AORUS M.2 PCIe 4.0 riser card to increase storage capacity and even build a RAID array through the OS for impressive storage performance and solid data integrity, fully taking advantage of the new PCIe 4.0 interface.

M.2 slots on the X570 AORUS Series Motherboards support PCIe 4.0 and SATA modes so users can purchase M.2 SSDs without compatibility concerns. The 64Gb/s bandwidth of PCIe 4.0 enables M.2 NVMe SSDs to perform at their full potential. Thermal throttling can be a detriment to SSD performance by slowing down read/write speeds and GIGABYTE has implemented M.2 Thermal Guards to combat the excess heat from device operation. M.2 SSD devices are protected from the heat and can perform like they are designed to.

The entire X570 AORUS lineup offers Intel® Gbe LAN and the X570 AORUS MASTER and X570 AORUS XTREME provide 2.5Gbps and 10Gbps connection speeds respectively. Gamers now have the fastest and most stable wired network connectivity with this setup. All WiFi enabled models in the lineup feature the Intel® WiFi 6 802.11ax standard which delivers blazing fast 2.4Gbps connection speeds that almost rival the 2.5Gbps Ethernet connection speeds. With both high-speed Ethernet and WiFi, users have extra flexibility and ridiculously fast connection speeds.

Fan favorite and well-received features from previous AORUS lineups make their return to select X570 AORUS motherboards. Sleek I/O shroud design, RGB Fusion LED lighting, Smart Fan, Hi-Fi audio, and many more trademark features have been further refined and added to the mix with AMD’s built-in features. The newest edition of Smart Fan technology is featured on two of the X570 AORUS motherboards and comes with a noise sensor that measures the decibel levels of the fan noise and enables users to adjust the noise levels to their liking for improved noise reduction. Silent and cool fan operation has never been more user friendly.

AORUS X570 series motherboards come with the newest version of Q-Flash Plus Technology. Users can easily update the BIOS without even installing a processor, memory, graphics cards, or booting up the PC so they can flash the BIOS without the concerns of not being able to boot up the system due to compatibility issues. X570 AORUS series motherboards use an upgraded BIOS interface, providing users with a more intuitive user interface so they can easily tune their settings to upgrade their performance and overclocking.

X570 AORUS motherboards use only the finest components reinforced by GIGABYTE Ultra Durable™ Technology to extend product durability and service life. Through the use of all solid caps, digital power designs, and Smart Fan technology to provide energy-conserving and effective cooling solutions, AORUS motherboards are an excellent choice for users seeking to build a high-end PC system so they can enjoy the best gaming experience motherboards have to offer.


AMD X570 AORUS Motherboard with Direct 16 Phases Infineon Digital VRM, Fins-Array Heatsink, NanoCarbon Baseplate, Triple PCIe 4.0 M.2 with Thermal Guards, Intel®WiFi 6 802.11ax, ESS SABRE HiFi 9218, AQUANTIA® 10GbE LAN+1GbE LAN, RGB FAN COMMANDER, RGB Fusion 2.0
  • Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • Direct 16 Phases Infineon Digital VRM Solution with 70A PowIRstage
  • Thermal Reactive Armor Design with Fins-Array Heatsink, Direct Touch Heatpipe and NanoCarbon Baseplate
  • Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
  • Onboard Intel® WiFi 6 802.11ax 2T2R & BT 5 with 2X AORUS Antenna
  • Rear 130dB SNR AMP-UP Audio with ALC1220-VB & ESS SABRE 9218 DAC with WIMA Audio Capacitors
  • AQUANTIA® 10GbE BASE-T LAN + Intel® Gigabit LAN with cFosSpeed
  • Exclusive RGB FAN COMMANDER for Professional Casemoders
  • USB TurboCharger for Mobile Device Fast Charge Support
  • RGB FUSION with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
  • Smart Fan 5 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
  • Front & Rear USB 3.1 Gen 2 Type-C™ Headers
  • Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card
  • CEC 2019 Ready, Save Power With a Simple Click

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