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GIGABYTE Z590 AORUS TACHYON Smashes the Overclocking Records with 11900K
World record-breaking performance of 7.31GHz overclocking and Super Pi with 11900K
April 1st, 2021 – Taipei, Taiwan – Gigabyte Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today Z590 AORUS TACHYON motherboard with the latest 11th generation Intel® Core™ i9 11900K processor and LN2 liquid nitrogen heat dissipation set the world-leading overclocking records of 7314MHz,
as well as breaks the world records of Super Pi 1M and Super Pi 32M. Update: (Not true, Rauf holds both world records on ASUS ROG Maximus APEX motherboard). GIGABYTE Z590 AORUS TACHYON motherboard equips with many functions designed for extreme overclockers, which promise overclockers higher scores with easier operation, establishing GIGABYTE’s leading role in overclocking on the Z590 motherboards.
“By the assistance of engineering design power and management team, GIGABYTE’s R&D team is able to turn those wild creativity into mass production.” said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. “GIGABYTE Z590 AORUS TACHYON motherboard is the master piece born from these innovative concepts in a period of deliberation, and prove GIGABYTE’s strong R&D strength on LN2 overclocking by the world records it made. Of course, we will also use Z590 AORUS TACHYON to create better overclocking performance, and can’t wait to see that overclockers around the world can use this motherboard to break more world records!”
GIGABYTE Z590 AORUS TACHYON is designed by overclockers to break the world record. Backed by Gigabyte’s widely recognized endurance and stability, GIGABYTE R&D team has devoted plenty resources to make this motherboard more in line with users’ needs. Z590 AORUS TACHYON adopts 12+1 direct phases power supply, which each of them can hold up to 100 amps with its DrMOS power stages design to provide comprehensive power management. The VRM area implements a full tantalum capacitor matrix, which enables the lower overall temperature and more stable overclocking. Furthermore, the latest Reactive Armor solution uses an integrated one-piece metal heat sink to provide larger heat dissipation range of MOSFET, while the multiple skived fins and grooved surface provide two times larger dissipation area than traditional design that improves dramatically the heat convention and conduction by allowing more airflow pass through the heatsink.
Moreover, the 2Oz PCB of CPU zone and exclusive 2DIMM Daisy Chain memory routing with an anti-interference design satisfies users with more flexibility on memory configuration and performance. The memory circuits are embedded within the PCB ground layers while the metal outer layer of the PCB reduces electromagnetic interference so that users can enjoy more high-speed, more stable overclocking RAM performance. The exclusive Overclocking kit of robust overclocking buttons and detection features allow overclockers to break through the limits with ease.
Besides the above exclusive designs, Z590 AORUS TACHYON motherboard is equipped with all GIGABYTE noted features, and advanced configuration of Intel® 2.5Gb Ethernet, WIFI 6E 802.11ax, USB 3.2 Gen2x2 TYPE-C® interface, and PCIe 4.0 expansion interface. Meanwhile, the revamped BIOS interface with Smart Fan 6 technology displays key information such as clock speeds, memory, storage devices, fan statuses/settings, temperature control, and other important hardware information in a more intuitive and user friendly manner. The addition of QFLASH makes it much easier for users to update their system BIOS by USB flash without installing a processor, memory, and VGA cards. For more Z590 AORUS TACHYON information and overclocking performance, please refer to GIGABYTE’s official website.
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