SK Hynix spills the beans on HBM3 memory
The High Bandwidth Memory is about to get even faster.
The memory manufacturer has revealed its plans for HBM3 memory. By releasing initial performance figures, the company has done so even before JEDEC (the body responsible for the HBM standard) has made the HBM3 specs official.
The company has revealed that its HBM3 memory which is currently under development, has already reached 665 Gbps bandwidth with 5.2 Gbps I/O speed. That’s a 44.6% and 44.4% increase respectively over the HBM2E standard. This is not SK Hynix’s the last word on HBM3 memory though, as other companies have already declared 7.2 Gbps I/O bandwidth, Tom’s Hardware notes.
SK hynix leads the HBM market with ambitions for even faster HBM solutions: Our HBM3, under development, will be capable of processing more than 665GB of data per second at 5.2Gbps in I/O speed. A table illustrating how SK hynix’s product specifications evolve between HBM2E and HBM3.
— SK Hynix
The HBM3 standard is not expected to reach the gaming market anytime soon. AMD’s endeavor into HBM Radeon RX graphics cards has ended with Vega architecture, leaving HBM exclusive to compute accelerators based on CDNA architecture. Other companies have expressed no interest in bringing HBM to the gaming series either. However, the next-generation compute accelerators such as Xe-HP(C) from Intel and rumored NVIDIA Hopper is likely to continue the success of stacked high bandwidth memory in their products.