Two chipsets yet no active cooling
MSI tries to share as much information on AMD AM5 platform as possible.
The company already confirmed AMD EXPO technology for DDR5 memory overclocking profiles, as well as published an installation guide AMD Ryzen 7000 engineering sample CPU. AMD was clearly not happy about MSI being so direct with all this information, after all Computex was only a showcase, not a full reveal. Thus, some of this information was already removed on AMD request.
But MSI is clearly not bothered. During their MSI Insider stream, the company showcased the AMD X670 chipset design without the heatspreaders. This is actually the first time we get to see the dual chipset design, that AMD confirmed but did not show by themselves.
AMD X670 motherboard, Source: MSI
The AMD AM5 platform featuring LGA1718 socket will host CPUs with up to 170W PPT (socket power). The first generation AM5 CPUs will be based on Zen4 architecture with support for DDR5 memory as well as PCIe Gen5 devices. The X670E and X670 chipsets with their dual chipset design will offer up to 24 PCIe Gen5 lanes for graphics and storage.
Although it was already confirmed by AMD, the new X670 chipsets do not require active cooling. This will greatly simply the design of AMD 600 series motherboards, lower the development cost and probably also means lower power requirement.
AMD X670 chipset cooling, Source: MSI
Computex Ryzen 7000 and X670 showcase is just a glimpse of what will be released this fall (officially). AMD promised to provide more details this summer. The B650 motherboards are to feature a single-chipset design, so that should mean even smaller heatsinks.
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