MSI confirms AMD EXPO
At Computex AMD confirmed two technologies that we have previously shared information on: Smart Access Storage and EXPO.
We have already shared news on AMD EXtended Profiles for Overclocking, but now it appears to be confirmed. AMD apparently decided to come up with an alternative to Intel’s XMP 3.0 overclocking profiles for DDR5 modules. However, the details are scarce, EXPO technology has only appeared in MSI X670 launch slides, while AMD did not mention this technology at all.
While AMD did not explain how EXPO works, we did get to see Ryzen 7000 CPU running alongside overclocked DDR5-6000 memory during live demos, as confirmed through launch slides footnotes.
As for the slide itself, there are a few interesting details that AMD did not share yet. Starting with 28 PCIe Gen5 lanes, while AMD claims it is actually 24. One might only guess why MSI and AMD share different information here, but it is possible that 28 lanes will be available for future SKUs, not necessary for first-gen AM5 Ryzen 7000 series.
There is also topic of 170W TDP. AMD confirmed recently that their 170W claim for the AM5 platform was referring to the PPT (Peak Package Tracing), which is basically a maximum power for the socket. The actual TDP should be lower, possibly between 105 to 125W range. Yet, MSI’s slide clearly mentions TDP. However, even if this number is PPT then it is already higher than Ryzen 5000 series’ 142W.
AMD has confirmed that the 170W figure for AM5 is PPT, not TDP.
— Paul Alcorn (@PaulyAlcorn) May 23, 2022
It appears that MSI has requested this slide to be removed from other websites, possibly because it mentioned EXPO, or because it contained wrong information altogether.
When MSI says Raphael/ Ryzen 7000 will support 28 PCIe 5.0 lanes and AMD says 24, does that mean they are using four lanes to connect the chipset(s)? pic.twitter.com/hVYKwWn9xf
— Andreas Schilling ?? (@aschilling) May 23, 2022