Intel LGA1700, Intel’s new era of hybrid desktop CPUs begins with this socket
A photo of Intel’s rectangular socket for next-gen heterogeneous CPU architecture has been posted on the Chinese social media platform.
On Bilibili there is a photo of the LGA1700 socket codenamed “15R1”. The CPU socket is visibly taller than LGA1200 (by 7.5 mm to be precise), but it has the same width of 37.5 mm. The socket will not necessarily require more space, as Intel has managed to make the latching system smaller.
The LGA1700 socket would be used by Intel Alder Lake (12th Gen Core) CPUs as well as its successor which is Raptor Lake (13th Gen Core). There are currently no public plans or leaks confirming whether Intel has plans to keep the socket for the 14th Gen core which is Meteor Lake.
The socket is marked as LGA-17XX/LGA-18XX, which further suggests that it may already have more than 100 unused pins for next-gen LGA CPUs with more than 1800 contact pads. Whether this is intended for a consumer or workstation CPU, we don’t know yet.
A new shape and lower Z-height of the LGA1700 CPUs will require cooling equipment manufacturers to ship compatible brackets for the new series. Various companies have already expressed their willingness to ship LGA1700 compatibility kits for free, or are planning to do so in the future.
|Intel LGA1700 Socket details|
|IHS to MB Height (Z-Stack, validated range):||6.529 – 7,532 mm|
|Thermal Solution Hole Pattern:||78 x 78 mm|
|Socket Seating Plane Height:||2.7 mm|
|Maximum Thermal Solution Center of Gravity Height from IHS:||25.4 mm|
|Static Total Compressive Minimum:||534N (120 lbf), Beginning of Life 356 N (80 lbf)|
|End of life maximum:||1068 N (240 lbf)|
|Socket Loading:||80-240 lbf|
|Dynamic Compressive Maximum:||489.5 N (110 lbf)|
|Maximum Thermal Solution Mass:||950 gm|
|Important Note:||A Keep In Zone is introduced for LGA17xx-18xx thermal solutions. Two volumes are provided.|
The Asymmetric volume provides the maximum available design space. The Symmetric volume
provides for designs to be rotatable on the board. The thermal solution under load should fit within the volume
Intel Alder Lake CPUs may indeed be taller, but most high-end CPU coolers, especially for the Core-X and Threadripper series, should already have a cooling plate big enough to cover the 12th Gen Core integrated heat spreader entirely.
The LGA1700 socket and 600/700 series motherboards should be compatible with the 12th and 13th Gen Core series. The latter is said to offer higher core counts, cache optimizations as well as higher memory frequency support.
|Intel Mainstream Desktop CPU Roadmap (Rumored)|
|VideoCardz.com||Alder Lake||Raptor Lake||Meteor Lake||Arrow Lake||Lunar Lake||Nova Lake|
|Launch Date||Q4 2021||Q4 2022||Q2 2023||Q4 2023||Q4 2024||2025|
|Fabrication Node||Intel 7||Intel 7||Intel 4||TBC||TBC||TBC|
|Big Core µArch||Golden Cove||Raptor Cove||Redwood Cove||Lion Cove||Lion Cove||Panther Cove|
|Small Core µArch||Gracemont||Gracemont||Crestmont||Skymont||Skymont||Darkmont|
|Graphics µArch||Gen12.2||Gen12.2||Gen 12.7||TBC||Gen 13||TBC|
|Max Core Count||16 (8C+8c)||24 (8C+16c)||TBC||40 (8C+32c)||TBC||TBC|
|PCIe Gen||PCIe 5.0||PCIe 5.0||PCIe 5.0||TBC||TBC||TBC|
|Intel Core Series||12th Gen Core||13th Gen Core (?)||14th Gen Core (?)||15th Gen Core (?)||16th Gen Core (?)||17th Gen Core (?)|
Source: 热心市民描边怪 (Bilibili)