Intel to disclose more details on Meteor/Arrow Lake with 3D Foveros packaging technology at HotChips 34

Published: 23rd May 2022, 12:13 GMT   Comments

Intel Meteor and Arrow Lakes at Hot Chips 34

Intel’s next-gen Meteor Lake and Arrow Lake architectures are to take a spotlight during one of the Hot Chips 34 presentations in August.

The upcoming Hot Chips symposium schedule has now been partially revealed. This event will include talks from AMD, Intel and NVIDIA speakers with conferences focusing on data centers, graphics, processor technology and accelerated computing. On August 23rd, Intel’s Wilfred Gomes (Microprocessor Design and Technologies) will give a speech on Meteor Lake and Arrow Lake with focus on the 3D packing technology called Foveros.

These new architectures which are not to be released until 2023 and 2024 respectively, will be based on a new hybrid tiled architecture with disaggregated IP blocks. These architectures will make use of Intel 4 and Intel 20A process technologies as well as ‘external’ N3 process. It is commonly believed that Meteor and Arrow Lake will use the same platform, similarly to Alder and soon-to-be-released Raptor Lake.

Hot Chips 34 schedule

Intel has recently confirmed Meteor Lake has successfully booted up in three operating systems: Windows, Linux and ChromeOS, marking an important moment in the architecture development. This new architecture is now on schedule to start shipping 2023 for clients. Thus far everything suggest it will launch for mobile platform first, but 125W desktop chips are also on the roadmap.

Intel’s 14th and 15th Gen Core focus will also be on graphics. Those will be Intel’s first series to feature the more-capable Xe-HPG gaming architecture. If rumors are to be believed, Arrow Lake-P, Intel’s mainstream design for thin & light systems in 2024, could ship with up to 320 Execution Units, more than 3 times more than Alder Lake.

Intel Mainstream CPU Roadmap (RUMORED)
VideoCardzAlder LakeRaptor LakeMeteor LakeArrow LakeLunar Lake
Launch DateQ4 2021Q4 2022Q2 202320242024+
Fabrication NodeIntel 7Intel 7Intel 4 &
External N3
Intel 20A &
External N3
Intel 18A &
External
Big Core µArchGolden CoveRaptor CoveRedwood CoveTBCLion Cove
Small Core µArch GracemontGracemontCrestmontCrestmont (?)Skymont
Graphics µArchXe-LPXe-LPXe-HPGXe-HPGXe2-HPG
Max CPU Core Count16 (8C+8c)24 (8C+16c)TBC40 (8C+32c)TBC
Max GPU Core Count96 EU96 EUTBC320 EUTBC
SocketLGA1700LGA1700TBCTBCTBC
Memory SupportDDR4/DDR5-4800DDR4/DDR5-5600DDR5TBCTBC
PCIe GenPCIe 5.0PCIe 5.0PCIe 5.0TBCTBC
Intel Core Series12th Gen Core13th Gen Core14th Gen Core15th Gen Core16th Gen Core

Source: Hot Chips via Tom’s Hardware




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