Intel Socket V (LGA1700)
An interesting piece on next-gen cooling has been published by Igor’sLAB.
Socket V (LGA1700) is the codename for the upcoming socket for Intel Alder Lake-S and possibly its successor Raptor Lake-S desktop processors. The new socket will take a more rectangular shape than LGA1200 for Comet and Rocket Lake-S series. According to new information, the CPU package and the socket will also be thinner. The so-called Z-height will be lower by at least one millimeter.
The slides that were published by Igor Wallossek cover the schematics and drawings of the new cooling for Socket V. According to those slides the Z-height of Socket V will be reduced compared to Socket H (LGA1200). As explained on the slides, by lowering the height, the socket would produce lower loads compared to socket H. However, because the cooler for Socket V will also have a new hole pattern, it will render all existing coolers incompatible without the necessary new brackets.
Intel Alder Lake-S LGA1700 (Socket V), Source: Igor’sLAB
Igor also gained access to preliminary schematics of high-performance thermoelectric cooling. For the LGA1200 CPU series, Intel partnered up with Cooler Master to launch MasterLiquid ML360 Sub-Zero cooling, which is based on the Peltier effect to create a heat flux between two types of materials. This cooler does indeed work great in certain scenarios, but it is not very power efficient, as it requires just as much power as the CPU itself. Judging from the leak, there are already blueprints for Alder Lake “Sub-Zero” cooler as well.
Intel Alder Lake-S LGA1700 reference cooler, Source: Igor’sLAB
The standard reference cooler is not getting any fancier with the Alder Lake generation. Those are of course for mid-range and entry-level processors which are usually under 65W. The cooler will not be compatible with existing models, so they cannot be used interchangeably. The drawings do not confirm if the cooler has a copper core attached to the aluminum heatsink.
The LGA1700 socket will move away from the square 37.5mm package in favor of a more rectangular 35.5×45.0mm size. It is still not as big as some previous-gen HEDT (high-end desktop) processors, thus chances of seeing many existing coolers still be compatible with Alder Lake are high, but only if necessary brackets will be provided by the cooling manufacturers.
Intel Alder Lake-S LGA1700 package, Source: VideoCardz
Source: Igor’sLAB
