Hot Chips 33: Intel, AMD & TSMC to discuss 3D packaging, Alder Lake architecture overview coming

Published: Aug 2nd 2021, 07:42 GMT   Comments

Hot Chips 33: 3D packaging, chiplets, Intel Alder Lake, and Sapphire Rapids

As a reminder, Intel will be disclosing the first details on its mainstream heterogeneous architecture at Hotchips 33.

On August 22nd, a 3-day technological symposium called Hot Chips 33 will begin. Due to uncertainty around the spread of Covid-19, it was decided that the symposium will not be an in-person conference. All content will be broadcasted through a live stream to registered attendees. The attendance is not free which is why the content shown at Hot Chips will not immediately appear elsewhere.

Although Hot Chips 33 schedule was already announced back in May, the organizers have now confirmed who will participate on the first day of the conference covering ‘Advanced Packing’. The schedule confirms that Intel and TSMC are to cover both chiplets and 3D packaging technologies, while Intel will also discuss its 2.5D packaging. AMD on the other hand will only cover 3D packaging.

It is also a reminder that on the second day Intel will discuss its Alder Lake and Sapphire Rapids processor architectures. At this moment it is unclear what exactly will be discussed, but one should not expect specifications or performance estimations just yet. This event is likely to focus on architectures themselves.

A day later, Intel will be disclosing details on its Ponte Vecchio accelerator while AMD will be providing an overview of RDNA2 architecture.

NVIDIA will also be sharing details on its DPU (DATA Center Processing Unit) and hosting a short tutorial on modern neural networks. The manufacturer will not be sharing details on its existing or upcoming architectures.

Source: Hotchips

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