AMD unveils Instinct MI300 exascale APU with 24 Zen4 cores 146B transistors

Published: 5th Jan 2023, 09:03 GMT   Comments

AMD shows off its MI300 at CES 2023

The next generation data-center processor has been confirmed to feature up to 24 Zen4 cores.

AMD Instinct MI300 presentation, Source: AMD

AMD wrapped up the CES 2023 keynote by introducing new details on its ‘world’s first data center integrated CPU + GPU’. This concept has been proven useful for the consumer market, by combining CPU and GPU cores on a single die, reducing the footprint of such integration and increasing efficiency.

AMD MI300 will take things to a new level, by using 3D die stacking technology and combining the CPU/GPU cores with high-speed memory. The MI300 is confirmed to feature up to 128GB of HBM3 memory, which can actually allow the CPU to be used without external memory.

AMD Instinct MI300 presentation, Source: AMD

In AMD CEO own words, AMD’s new Instinct combines up to 24 EPYC Zen4 cores and CDNA3 compute architecture within nine 5nm chiplets placed on top of four 6nm chiplets. This technology will be the first time AMD is using 3D die stacking. Dr. Lisa Su confirmed that the chip is already in the labs and has showcased one of the chips during the keynote. The processor is officially coming in the second half of this year.

AMD Instinct MI300 presentation, Source: AMD

The MI300 ‘APU’ is a successor to MI250 based on CDNA2 architecture, which was released last year. AMD is not providing any performance figures for its CDNA3 based chip yet, therefore comparisons are not possible. But this will be undoubtedly a massive change to AMD EPYC/Instinct product stack regardless.

AMD Instinct Accelerators Specifications
VideoCardzAMD Radeon Instinct MI60AMD Instinct MI100AMD Instinct MI250XAMD Instinct MI300
Launch Year2018202020222023
Fabrication Nodes7nm7nm6nm MCM5nm + 6nm
3D Die Stacking
CPUup to 24 Zen4 cores
GPUVega 20 GCN5 (GFX906)Arcturus CDNA1 (GFX908)Aldebaran CDNA2 (GFX90A)CDNA3 (GFX940) 
Base Chipletsup to 2
Compute Tiles112 up to 8
Compute Units64120220TBC
GPU Clock Speed1800 MHz~1500 MHz~1700 MHzTBC
FP16 Compute29.5 TFLOPS185 TFLOPS383 TFLOPSTBC
FP32 Compute14.7 TFLOPS23.1 TFLOPS47.9 TFLOPSTBC
FP64 Compute7.4 TFLOPS11.5 TFLOPS47.9 TFLOPSTBC
VRAM32 GB HBM232 GB HBM2128 GB HBM2e128GB HBM3
Memory Clock2.0 Gbps2.4 Gbps 3.2 GbpsTBC
Memory Bus4096-bit4096-bit8192-bit up to 8192-bit
Memory Bandwidth1 TB/s1.23 TB/s3.2 TB/sTBC
Form FactorDual Slot, Full LengthDual Slot, Full LengthOAMOAM
TDP300W300W560W up to 600W+

Source: AMD




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