AMD Ryzen Embedded V3000 series with 6nm Zen architecture
Fresh leaks on the new embedded series from AMD.
Patrick Schur revealed the first details on Zen3 based Embedded series codenamed V3000. According to the information posted, a successor to the V2000 series with Zen2 cores will see a significant upgrade in terms of specifications.
First and foremost, the V3000 series will feature Zen3 at 6nm fabrication process. So far we have only learned about the Rembrandt APU series, also rumored to feature 6nm node but also Zen3+ core architecture. It would seem that AMD will be making a mid-architecture switch to 6nm at least for some of its product series. It is worth noting that AMD is also working on Ryzen desktop CPUs based on Zen3 architecture with its new V-Cache technology.
The Ryzen Embedded V3000 will be offered with at least three SKUs, ranging from 6 core/12 thread configuration up to 8 core/16 thread. The series will support up to two DDR5-4800 memory modules (each with two channels) with ECC support and also two USB 4.0 ports.
In terms of GPU performance, one should expect the V3000 series to feature up to 12 Compute Units, which is an upgrade over 8 CUs on the V2000 series. The PCI Express link will also be upgraded from 3.0 standard to 4.0, but the number of lanes will be kept at 20.
It is unclear when is AMD going to announce its new Embedded series, but AMD should not launch V3000 until at least November this year, after all, the V2000 series were only introduced 7 months ago.
| AMD Ryzen Embedded | |||
|---|---|---|---|
| V1000 | V2000 | V3000 | |
| Core Architecture | 14nm Zen | 7nm Zen2 | 6nm Zen3 |
| Maximum Configuration | 4C/8T | 8C/16T | 8C/16T |
| Maximum GPU Cores | 11 CUs (GCN5/Vega) | 8 CUs (GCN5/Vega) | 12 CUs (RDNA2) |
| PCI Express Support | 16x PCIe 3.0 | 20x PCIe 3.0 | 20x PCIe 4.0 |
| Memory Support | Dual DDR4-3200/2400 ECC | Dual DDR4-3200 ECC | Dual DDR5-4800 ECC |
The leaked V3000 series specs appear to share a lot with what we already know about Rembrandt based APU series, which begs a question if both are to use the same silicon:
AMD Notebook Silicon Roadmap, Source: @Broly_X1
AMD Ryzen Embedded – V3000
Zen 3 (6 nm) – FP7r2– up to 8 Cores / 16 Threads
– 20x PCIe 4.0 lanes (8x dGPU)
– 4x DDR5-4800 (ECC)
– two 10G ethernet PHYs
– 2x USB 4.0
– 15-30 W and 35-54 W models
– up to 12 CUs (RDNA2)— Patrick Schur (@patrickschur_) June 21, 2021
| AMD Ryzen Embedded Series | ||||||
|---|---|---|---|---|---|---|
| Cores/Threads | Base Clock | Turbo Clock | Graphics Units | Graphics Clock | TDP | |
| (6nm Zen3, FP7r2, RDNA2 iGPU, DDR5-4800 ECC) | ||||||
| V3748 | ||||||
| V3718 | ||||||
| V3516 | ||||||
| (7nm Zen2, FP7, GCN5 iGPU, DDR4-3200 EEC) | ||||||
| V2748 | ||||||
| V2718 | ||||||
| V2546 | ||||||
| V2516 | ||||||
Source: Patrick Schur