AMD Zen4 delidded
TechPowerUP reports that an unnamed overclocker has already been able to delid the upcoming AMD Zen4 CPU.
The site reports that the photograph was more than likely not meant to be shared outside of the closed group, thus the overclocker is not named and no links to the original source are provided.
The new integrated heatspreader (IHS) is a true challenge for delidding. The capacitors located around the CPU already make this process very complicated not to mention the fact that both the I/O and chiplets are soldered. At least the IHS appears to be glued to the package in only a few (7?) spots. However, there is no information on whether the CPU still works after this delidding attempt.
The Ryzen 7000 series are to feature two chiplet design, each carrying up to eight Zen4 cores. The new I/O die now made in 6 nm process technology will feature integrated RDNA2 graphics. The new Ryzen series for desktop are officially launching this fall.
|AMD Mainstream Desktop CPU Series|
|Core µArch||7nm Zen2||7nm Zen3||7nm Zen3D||5nm Zen4||Zen5|
|Launch Date||July 2019||November 2020||April 2022||Fall 2022||2023|
|AMD Ryzen Series||Ryzen 3000||Ryzen 5000||Ryzen 5000X3D||Ryzen 7000||Ryzen 8000|
|Max Core Count||16||16||16||16||TBC|
|Max PTT||142W||142W||142W||230W||230W (?)|
|Max TDP||105W||105W||105W||170W||170W (?)|
|PCIe Gen||PCIe Gen4||PCIe Gen4||PCIe Gen4||PCIe Gen5||PCIe Gen5|
|Motherboard Chipset||AMD 400||AMD 500||AMD 500||AMD 600||TBC|