AMD Raphael CPU heatspreader allegedly has open cutouts for capacitors

Published: 5th Jun 2021, 18:41 GMT   Comments

Update on AMD Raphael IHS design

ExecutableFix has shared a new render of the upcoming AMD Raphael processor based on Zen4 architecture.

AMD Raphael would have a much more sophisticated design than previously expected. Not only does the integrated heat spreader (IHS) for Raphael CPU does not have a uniform design, but it allegedly also has open cutouts for capacitors. This is quite an upgrade over the simple IHS design of AM4 Ryzen CPUs.

ExecutableFix had previously revealed that the AM5 package will require a Land Grid Array (LGA) socket, which would replace Zen3 CPU pins with pads. Some users have noticed that there were no capacitors on the back of the CPU and there wasn’t much room left on the other side. Thus, it was speculated that those capacitors could either be hidden under the IHS or in those cutouts around the IHS. The latter has been proven correct, at least it is according to the latest leak from ExecuFix:

Just today we covered a different AM5 leak from Gamers Nexus, who gained access to alleged AMD internal slides confirming codenames of both Raphael and Warhol. The data featured there was not as accurate as ExectuFix’s reporting, but those slides are dated and there clearly has been a change since they were made.

AMD Raphael is now expected to debut in late 2022 with Zen4 cores on the AM5 socket (LGA1178). It is expected that these CPU series will feature DDR5 support exclusively and will only support PCIe Gen4 standard at launch. Some of this might change down the road as the AM5 platform becomes more popular as AMD releases more CPUs for this new socket.

The new Raphael IHS design will definitely be a delidding nightmare, however, it remains to be confirmed if new Zen4 CPUs are soldered to the IHS like it is on high-end Ryzen CPUs these days.


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