Please note that this post is tagged as a rumor.
AMD’s product to feature X3D die stacking is Milan-X?
A new rumor suggests AMD is now actively developing Milan chip with stacked dies.
AMD has revealed back in March 2020 that is now working on its X3D packing technology that would feature hybrid 2.5D and 3D design. Today Patrick Schur has revealed a codenamed that might be associated with this technology. The first AMD product to featured stacked dies could be Milan-X, which would likely feature Zen3 cores.
AMD is working on a new CPU (codename Milan-X) that will use stacked dies. ?
— Patrick Schur (@patrickschur_) May 25, 2021
Another leaker (ExecutableFix) has confirmed that the product also carries a codename of Milan-X(3D). It is also revealed that it features Genesis-IO die. Genesis is a codename of current-gen EPYC Zen3 architecture.
Milan-X aka Milan-X(3D). Genesis IO-die with stacked chiplets
I love lasagna ? https://t.co/O2FrGxyd8P
— ExecutableFix (@ExecuFix) May 25, 2021
According to our sources, Milan-X is not expected to focus on core count but rather on increased bandwidth. It is not a consumer product, but a data center-oriented processor. At Financial Analyst Day, AMD released a simplified diagram featuring four compute tiles in a 2×2 pattern and stacked memory around the chip. This packing technology is called X3D as it denotes a hybrid approach.
Consumer products with stacked dies are probably very far away from now. At this moment processor designs are focusing around Multi-Chip-Module (MCM) designs and hybrid core architectures (with high-efficiency and high-performance cores). The leaks could suggest that we might hear more about Milan-X during the AMD keynote at Computex though, this event is scheduled for next week.