AMD ‘accelerates’ plans for Instinct MI200 with MCM design?
AMD Instinct MI200 to launch this year.
According to a leak posted by Komachi, AMD is planning to introduce its new compute accelerator called Instinct MI200 already this year. The MI200 is a next-gen CDNA-based accelerator that is rumored to feature MCM design. The specifications are unknown, but it is believed that MI200 could feature twice as many cores as Arcturus.
AMD Instinct MI200 is expected to debut with Frontier supercomputer alongside AMD Trento EPYC CPUs. The changes compared to Milan are not yet known, but they are either optimized for the supercomputer’s operation or provide new features such as PCI Gen5 support.
AMD Trento and MI200 Launch Date, Source: @KOMACHI_ENSAKA
The product is listed as MCM Special FIO Accelerator. The MCM stands for multi-chip-module while FIO means “Factory Installation Option”. It is also confirmed that the MI200 would use the OAM form factor (open-source accelerator infrastructure). According to the document, the accelerator will be available with an HPE Cray EX supercomputer.
AMD Instinct MI200, Source: @KOMACHI_ENSAKA
Earlier this week, an article was written at Coelacanth’s Dream claiming that MI200 could still be based on GFX900 GPU Vega architecture (GFX90A). This is the same graphics family tree as MI100’s GFX9. However, the accelerator would now support full-rate FP64 as noted by a feature added to instruction set architecture (ISA): “FullRate640ps”.
|AMD Instinct Accelerators|
|Accelerator Name||AMD Radeon Instinct MI60||AMD Instinct MI100||AMD Instinct MI200|
|Architecture||7nm GCN5||7nm CDNA1 (GFX908)||CDNA2 (GFX90A) ?|
|GPU||Vega 20||Arcturus||Unknown Multi-Chip|
|GPU Clock Speed||1800 MHz||~1500 MHz||TBC|
|FP16 Compute||29.5 TFLOPs||185 TFLOPs||TBC|
|FP32 Compute||14.7 TFLOPs||23.1 TFLOPs||TBC|
|FP64 Compute||7.4 TFLOPs||11.5 TFLOPs||TBC|
|VRAM||32 GB HBM2||32 GB HBM2||TBC|
|Memory Clock||1000 MHz||1200 MHz||TBC|
|Memory Bus||4096-bit bus||4096-bit bus||TBC|
|Memory Bandwidth||1 TB/s||1.23 TB/s||TBC|
|Form Factor||Dual Slot, Full Length||Dual Slot, Full Length||OAM|
|Cooling||Passive Cooling||Passive Cooling||TBC|