Taiwan Semiconductor Manufacturing Company on Monday announced that its 28nm process is in volume production and production wafers have been shipped to customers, including AMD, Altera, Nvidia, Qualcomm and Xilinx. TSMC is the first contract maker of semiconductors to achieve volume production at 28nm node.

“Being the first to 28nm volume production demonstrates TSMC’s leadership in technology and brings great value to our customers through design wins with competitive products,”

said Jason Chen, TSMC’s senior vice president of worldwide sales and marketing.

At present, TSMC produces chips using 28HP [high-performance with HKMG], 28HPL [high-performance low-power with HKMG] and 28LP [low-power with SiON] are all in volume production and 28HPM will be ready for production by the end of this year. The production-version design collateral of 28HPM has been distributed to most mobile computing customers for their product-design use.

According to TSMC, the number of customer 28nm production tape outs has more than doubled as compared with that of 40nm. At 28nm, there are currently more than 80 customer product tape-outs. The TSMC 28nm process has surpassed the previous generation’s production ramps and product yield at the same point in time due to closer and earlier collaboration with customers, the contract maker stressed.

• READ MORE (Source): TSMC Begins to Manufacture 28nm Chips for AMD, Nvidia, Qualcomm – X-bit labs